Intel CPU BX80646I34360 Core i3-4360 3.7G 4M LGA1150 2Core-4Thread Haswell RF
Family
Intel Core i3
Model number
i3-4360
CPU part numbers
BX80646I34360 is a boxed microprocessor
Frequency
3700 MHz
Bus speed
5 GT/s DMI
Clock multiplier
37
Package
1150-land Flip-Chip Land Grid Array
Socket
Socket 1150 / H3 / LGA1150
Architecture / Microarchitecture
Microarchitecture:Haswell
Processor core: Haswell
Manufacturing process:0.022 micron
Data width:64 bit
The number of cores:2
The number of threads:4
Floating Point Unit:Integrated
Level 1 cache size:
2 x 32 KB instruction caches
2 x 32 KB data caches
Level 2 cache size:2 x 256 KB
Level 3 cache size:4 MB shared cache
Multiprocessing:Uniprocessor
Features
1.MMX instructions
2.SSE / Streaming SIMD Extensions
3.SSE2 / Streaming SIMD Extensions 2
4.SSE3 / Streaming SIMD Extensions 3
5.SSSE3 / Supplemental Streaming SIMD Extensions 3
6.SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
7.AES / Advanced Encryption Standard instructions
8.AVX / Advanced Vector Extensions
9.AVX2 / Advanced Vector Extensions 2.0
10.BMI / BMI1 + BMI2 / Bit Manipulation instructions
11.F16C / 16-bit Floating-Point conversion instructions
12.FMA3 / 3-operand Fused Multiply-Add instructions
13.EM64T / Extended Memory 64 technology / Intel 64
14.NX / XD / Execute disable bit
15.HT / Hyper-Threading technology
16.VT-x / Virtualization technology
Low power features
Enhanced SpeedStep technology
Integrated peripherals / components
Integrated graphics:GPU Type: HD 4000 series
Memory controller:
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3
Other peripherals:
Direct Media Interface 2.0
PCI Express 3.0 interface
Electrical / Thermal parameters
Thermal Design Power: 54 Watt
Item Dimension (L"xW"xH"):
4.49 x 3.19 x 4.02
Weight:
0.75 lb
Warranty Information:
3-year limited
Intel Core i3
Model number
i3-4360
CPU part numbers
BX80646I34360 is a boxed microprocessor
Frequency
3700 MHz
Bus speed
5 GT/s DMI
Clock multiplier
37
Package
1150-land Flip-Chip Land Grid Array
Socket
Socket 1150 / H3 / LGA1150
Architecture / Microarchitecture
Microarchitecture:Haswell
Processor core: Haswell
Manufacturing process:0.022 micron
Data width:64 bit
The number of cores:2
The number of threads:4
Floating Point Unit:Integrated
Level 1 cache size:
2 x 32 KB instruction caches
2 x 32 KB data caches
Level 2 cache size:2 x 256 KB
Level 3 cache size:4 MB shared cache
Multiprocessing:Uniprocessor
Features
1.MMX instructions
2.SSE / Streaming SIMD Extensions
3.SSE2 / Streaming SIMD Extensions 2
4.SSE3 / Streaming SIMD Extensions 3
5.SSSE3 / Supplemental Streaming SIMD Extensions 3
6.SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
7.AES / Advanced Encryption Standard instructions
8.AVX / Advanced Vector Extensions
9.AVX2 / Advanced Vector Extensions 2.0
10.BMI / BMI1 + BMI2 / Bit Manipulation instructions
11.F16C / 16-bit Floating-Point conversion instructions
12.FMA3 / 3-operand Fused Multiply-Add instructions
13.EM64T / Extended Memory 64 technology / Intel 64
14.NX / XD / Execute disable bit
15.HT / Hyper-Threading technology
16.VT-x / Virtualization technology
Low power features
Enhanced SpeedStep technology
Integrated peripherals / components
Integrated graphics:GPU Type: HD 4000 series
Memory controller:
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3
Other peripherals:
Direct Media Interface 2.0
PCI Express 3.0 interface
Electrical / Thermal parameters
Thermal Design Power: 54 Watt
Item Dimension (L"xW"xH"):
4.49 x 3.19 x 4.02
Weight:
0.75 lb
Warranty Information:
3-year limited
