Intel CPU BX80646G3258 Pentium G3258 3.20GHz 3M LGA1150 2Core-2Thread Haswell RF
Processor Number:
G3258
No. of Cores:
2
No. of Threads:
2
Clock Speed:
3.2 GHz
DMI2:
3 MB
DMI2:
5 GT/s
No. of QPI Links:
0
Instruction Set:
64-bit
Instruction Set Extensions:
SSE4.1/4.2
Embedded Options Available:
No
Lithography:
22 nm
Scalability:
1S Only
Max TDP:
53 W
Thermal Solution Specification:
PCG 2013C
- Memory Specifications
Max Memory Size (dependent on memory type): 32 GB
Memory Types: DDR3-1333
No. of Memory Channels: 2
Max Memory Bandwidth: 21.3 GB/s
ECC Memory Supported: Yes
- Graphics Specifications
Processor Graphics: Intel HD Graphics
Graphics Base Frequency: 350 MHz
Graphics Max Dynamic Frequency: 1.1 GHz
Graphics Video Max Memory: 1.7 GB
Intel Quick Sync Video: Yes
Intel Clear Video HD Technology: Yes
No. of Displays Supported: 3
Expansion Options
PCI Express Revision: 3.0
PCI Express Configurations: Up to 1x16, 2x8, 1x8/2x4
Max No. of PCI Express Lanes: 16
-Package Specifications
Max CPU Configuration: 1
TCASE: 72C
Package Size: 37.5mm x 37.5mm
Graphics and IMC Lithography: 22nm
Sockets Supported: FCLGA1150
Low Halogen Options Available: See MDDS
- Advanced Technologies
Intel Turbo Boost Technology: No
Intel vPro Technology: No
Intel Hyper-Threading Technology: No
Intel Virtualization Technology (VT-x): Yes
Intel Virtualization Technology for Directed I/O (VT-d): No
Intel VT-x with Extended Page Tables (EPT): Yes
Intel TSX-NI: No
Intel 64: Yes
Idle States: Yes
Enhanced Intel SpeedStep Technology: Yes
Thermal Monitoring Technologies: Yes
Intel Stable Image Platform Program (SIPP): No
- Intel Data Protection Technology
AES New Instructions No
- Intel Platform Protection Technology
Trusted Execution Technology: No
Execute Disable Bit: Yes
Item Dimension (L"xW"xH"):
4.49 x 3.19 x 4.02
Weight:
2.52 lb
Warranty Information:
3 Years Limited
G3258
No. of Cores:
2
No. of Threads:
2
Clock Speed:
3.2 GHz
DMI2:
3 MB
DMI2:
5 GT/s
No. of QPI Links:
0
Instruction Set:
64-bit
Instruction Set Extensions:
SSE4.1/4.2
Embedded Options Available:
No
Lithography:
22 nm
Scalability:
1S Only
Max TDP:
53 W
Thermal Solution Specification:
PCG 2013C
- Memory Specifications
Max Memory Size (dependent on memory type): 32 GB
Memory Types: DDR3-1333
No. of Memory Channels: 2
Max Memory Bandwidth: 21.3 GB/s
ECC Memory Supported: Yes
- Graphics Specifications
Processor Graphics: Intel HD Graphics
Graphics Base Frequency: 350 MHz
Graphics Max Dynamic Frequency: 1.1 GHz
Graphics Video Max Memory: 1.7 GB
Intel Quick Sync Video: Yes
Intel Clear Video HD Technology: Yes
No. of Displays Supported: 3
Expansion Options
PCI Express Revision: 3.0
PCI Express Configurations: Up to 1x16, 2x8, 1x8/2x4
Max No. of PCI Express Lanes: 16
-Package Specifications
Max CPU Configuration: 1
TCASE: 72C
Package Size: 37.5mm x 37.5mm
Graphics and IMC Lithography: 22nm
Sockets Supported: FCLGA1150
Low Halogen Options Available: See MDDS
- Advanced Technologies
Intel Turbo Boost Technology: No
Intel vPro Technology: No
Intel Hyper-Threading Technology: No
Intel Virtualization Technology (VT-x): Yes
Intel Virtualization Technology for Directed I/O (VT-d): No
Intel VT-x with Extended Page Tables (EPT): Yes
Intel TSX-NI: No
Intel 64: Yes
Idle States: Yes
Enhanced Intel SpeedStep Technology: Yes
Thermal Monitoring Technologies: Yes
Intel Stable Image Platform Program (SIPP): No
- Intel Data Protection Technology
AES New Instructions No
- Intel Platform Protection Technology
Trusted Execution Technology: No
Execute Disable Bit: Yes
Item Dimension (L"xW"xH"):
4.49 x 3.19 x 4.02
Weight:
2.52 lb
Warranty Information:
3 Years Limited
